Dyndrite, a 3D printing software program developer, is becoming a member of the IAM3DHUB consortium, run by Leitat, to speed up the adoption of steel laser-powder mattress fusion (LPBF) throughout Spain and Europe.
Dyndrite’s LPBF Professional provides customers Energy, Freedom, and Management instruments wanted to optimize even probably the most advanced of builds. Constructed on a GPU-accelerated geometry engine and utilizing complete toolpath APIs, the software program empowers superior construct preparation, parameter set growth, and toolpath optimization.
With LPBF Professional, producers can: dramatically scale back handbook labour and time to organize builds, enabling sooner iteration and deployment; develop high-yield parameter units for steel alloys to allow low overhangs, skinny wall options, higher floor end, and excessive yield parameters; configure support-free or minimal-support methods, thereby decreasing scrap and lowering post-processing price; and combine seamlessly with machine builders and supplies suppliers to ship traceable, repeatable, production-level workflows.
By becoming a member of IAM3DHUB, Dyndrite goals to associate with a wealthy ecosystem of AM {hardware}, supplies, software program, and end-user stakeholders to advance steel LPBF adoption in Europe. IAM3DHUB, based mostly on the DFactory Barcelona website and managed by Leitat, is a acknowledged Digital Innovation Hub that gives producers ‘take a look at earlier than make investments’ entry, coaching, and one-stop help for additive manufacturing applied sciences.
“I’m excited on the prospect of working with IAM3DHUB and the distinctive associate organizations it brings collectively,” mentioned Stephen Anderson, Chief Industrial Officer at Dyndrite Company. “Their deep experience throughout steel LPBF, supplies, {hardware}, and functions completely enhances Dyndrite’s mission to supply customers with the superior instruments required to scale production-ready steel additive manufacturing. Collectively, we might help end-users make higher components sooner, with OEM interoperability and utilizing novel qualification methods to cut back time to market and drive down price.”
